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Dry Etching

Dry Etching

Electron Beam Lithography Technology SiN

Electron Beam Lithography Technology SiN

Electron Beam Lithography Technology SOI

Electron Beam Lithography Technology SOI

Electronic Design Platform (CAD)

Electronic Design Platform (CAD)

FDM 3D-printing

FDM 3D-printing

Fiber Optics Probes

Fiber Optics Probes

Fibre optic probes

Fibre optic probes

Flexible and wearable diagnostic patches

Flexible and wearable diagnostic patches

Flexible Foil adhesive tape bonding

Flexible Foil adhesive tape bonding

Flexible Foil Laser welding

Flexible Foil Laser welding

Flexible Foil Machining for Microfluidic

Flexible Foil Machining for Microfluidic

Fluidic Simulations

Fluidic Simulations

Fluidics Lab

Fluidics Lab

Fly Probe Testing

Fly Probe Testing

Folded Optical Fiber Interconnect

Folded Optical Fiber Interconnect

Free-space optics (systems)

Free-space optics (systems)

Functional Testing

Functional Testing

Furnace Processing

Furnace Processing

He-leaktesting to qualify hermeticity

He-leaktesting to qualify hermeticity

high-accuracy multi-chip die bonding

high-accuracy multi-chip die bonding

Characterisation of optical systems

Characterisation of optical systems

Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP)

III-V materials epitaxy

III-V materials epitaxy

III-V processing

III-V processing

III-V-on-Si via Micro-Transfer-Printing

III-V-on-Si via Micro-Transfer-Printing