Next to iSIPP50G, Imec offers a dedicated and flexible silicon photonics prototyping and production services, specifically tuned to the needs of a single partner, on both 200mm and 300mm wafers (referred to as iSiPP200 and iSiPP300). Features of this run include:

- A full platform 8" (iSIPP200) and 12" (iSIPP300) wafer run.

- Flexible - to semi-flexible runs upon requests (max 4 customers on 1 run).

- Dies from up to 3 wafers (20 dies minimum).

- Customization available.

- Dedicated testing available.

- Mask and processing costs can be shared for iSIPP200 run.

- Optional modules: silicon nitride (SiN) or silicon oxide nitride (SiON) edge couplers, local undercut (UCUT) for thermal insulation.

- iSIPP200: Underbump metallic for flip-chip assemblies.

- iSIPP300: Advanced packaging options (e.g. through-silicon vias (TSVs) and micro-bumps for dense 3D system integration).