400nm iSIPP technology
MedPhab partner
Photonic components
PHOTONIC COMPONENTS [Integrated circuits] Silicon photonics
PC1 Integrated circuits
Silicon photonics
Technology provider Manufacturer R&D
The separate imec technology is dedicated on III-V-on-Si integration. It comprises of 400nm Si guided layer, two etch steps. Poly layer and different metal interconnects are provided within the run. The process is based on equivalent 220nm runs with some simplifications. No active components.

At imec we offer III-V device integration on 400nm iSIPP platform. Some features:

  • Bottom Oxide : 2 micrometers
  • Silicon layer : 400 nanometers
  • Partially etched Silicon : 220 nanometers

Today's output - a few dies per customer.

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6 months