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400nm iSIPP technology

Organization name

imec

Organization/department description

Organisation is

MedPhab partner

Offering type

[TECHNICAL] TECHNICAL SERVICES

Offering block

Photonic components

Technology

PHOTONIC COMPONENTS [Integrated circuits] Silicon photonics

Photonic Components

PC1 Integrated circuits

Silicon photonics

PC2 Microoptics

PC3 Fiberoptics

PC4 Opticalcomponents

PC5 Active components

Non Photonic Peripherals

NP1 Electronics

NP2 Optomechanics

NP3 Microfluidics

NP4 MEMS

Integration

IN1 Fiber/waveguide coupling

IN2 Optical assembly

IN3 Component assembly

IN4 Surface activation

Post-Processing

PP1 Over moulding

PP2 Hermetic sealing

PP3 Opto fluidic interface

PP4 Thin film deposition

Development support

Non technical services

Field of application

Target customers / applications

Technology provider Manufacturer R&D

Offering Description

The separate imec technology is dedicated on III-V-on-Si integration. It comprises of 400nm Si guided layer, two etch steps. Poly layer and different metal interconnects are provided within the run. The process is based on equivalent 220nm runs with some simplifications. No active components.

Offering Reports

Offering specifications

At imec we offer III-V device integration on 400nm iSIPP platform. Some features: