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III-V-on-Si via Micro-Transfer-Printing
Organization name
imec
Organization/department description
Organisation is
MedPhab partner
Offering type
[TECHNICAL] TECHNICAL SERVICES
Offering block
Photonic components
Technology
PHOTONIC COMPONENTS [Integrated circuits] Silicon photonics
Photonic Components
PC1 Integrated circuits
PC1 Integrated circuits
Silicon photonics
InP
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP1 Electronics
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Integration
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
Non technical services
Field of application
Target customers / applications
Technology provider
R&D
Offering Description
At imec we offer III-V device integration on 400nm iSIPP platform. Some features: - III-V Sample scale integration - Assist wafer scale manufacturing - Today's output - a few dies per customer.
Offering Reports
Offering specifications
Interuniversitair Micro-Elektronica Centrum
Alignment accuracy
1,5
micrometers
Min coupon size
50 x 50
micrometers
Max coupon size
2000 x 50
micrometers
Printing time
45
Sec/print
Offering Reports description
Version
TRL
3
4
MRL
2
3
ISO certification
Production volume
N/A
I am interested
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