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Adhesive die bonding
CSEM SA
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
MedPhab partner
[TECHNICAL] TECHNICAL SERVICES
Non-photonic peripherals
NON-PHOTONIC PERIFERALS [Microfluidics] Adhesives
NP3 Microfluidics
Adhesives
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Clinical Consultancy Equipment
Adhesive die bonding with epoxies, acrylates, silicones etc. UV-, RT-, heat and mixed-mode cure are available options.
Minimum die size 0.5 x 0.5 mm^2
Maximum die size 50 x 50 mm^2
Minimum substrate size 1 x 1 mm^2
Maximum substrate size 150 x 150 mm^2
Substrate thickness 50 mm
Substrate material All
Adhesive die bonding with epoxies, acrylates, silicones etc. UV-, RT-, heat and mixed-mode cure are available options.
CSEM NP3 0006 V1.0
1 2 3 4 5 6 7 8
1 2 3 4 5
ISO 9001
Up to 1000 devices per month
Link to Organization registry