community
Website
MedPhab community
MENU
Community marketplace
»
Organization registry
»
Community repository
»
back
He-leaktesting to qualify hermeticity
Organization name
CSEM SA
Organization/department description
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
Organisation is
MedPhab partner
Offering type
[TECHNICAL] DEVELOPMENT SUPPORT
Offering block
Development Support
Technology
DEVELOPMENT SUPPORT [Characterization testing /services] Analyze, measure, characterize (e.g.) microfluidics
Photonic Components
PC1 Integrated circuits
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP1 Electronics
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Integration
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
"[Characterization testing /services] Analyze, measure, characterize (e.g.) microfluidics"
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
therapeutics
others
Target customers / applications
Technology provider
Supplier
Manufacturer
Production services
Integrator
R&D
Consultancy
Offering Description
The Helium Leak-testing method is used to check hermeticity of atmospheric pressure (or vacuum) sealed package/modules and even down to chip-on-chip level. This tool can be used also with plastics provided the thickness of the walls are large enough to prevent Helium permeation.
Offering Reports
Offering specifications
Measurement modes
spray test or bombing test
Bombing chamber up to 5Bar
available
Helium Leakrate resolution
<5*10E-12 (Helium)
mBar*L/s
Sample size
Any size is possible. Large size usually tested in spray test mode
Custom sample fixture for connecting chips
Available to test with miniature o-rings/solder chip-to-chip bonding
Software for measurement data-logging
Available
Offering Reports description
The Helium Leak-testing method is used to check hermeticity of atmospheric pressure (or vacuum) sealed package/modules and even down to chip-on-chip level.
Version
CSEM DS3 0009 V1.0
TRL
MRL
ISO certification
ISO 9001 / Mil. STD. 883 method 1014
Production volume
N/A
I am interested
Link to Organization registry
E-mail
Contact person
Contact function
Organization name
You can write a note here.