He-leaktesting to qualify hermeticity
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
[TECHNICAL] DEVELOPMENT SUPPORT
DEVELOPMENT SUPPORT [Characterization testing /services] Analyze, measure, characterize (e.g.) microfluidics
PC1 Integrated circuits
PC5 Active components
Non Photonic Peripherals
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
IN4 Surface activation
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
"[Characterization testing /services] Analyze, measure, characterize (e.g.) microfluidics"
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
Target customers / applications
The Helium Leak-testing method is used to check hermeticity of atmospheric pressure (or vacuum) sealed package/modules and even down to chip-on-chip level. This tool can be used also with plastics provided the thickness of the walls are large enough to prevent Helium permeation.
spray test or bombing test
Bombing chamber up to 5Bar
Helium Leakrate resolution
Any size is possible. Large size usually tested in spray test mode
Custom sample fixture for connecting chips
Available to test with miniature o-rings/solder chip-to-chip bonding
Software for measurement data-logging
Offering Reports description
The Helium Leak-testing method is used to check hermeticity of atmospheric pressure (or vacuum) sealed package/modules and even down to chip-on-chip level.
CSEM DS3 0009 V1.0
ISO 9001 / Mil. STD. 883 method 1014
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