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Sheartest to evaluate wirebonds/bonding
Organization name
CSEM SA
Organization/department description
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
Organisation is
MedPhab partner
Offering type
[TECHNICAL] DEVELOPMENT SUPPORT
Offering block
Development Support
Technology
DEVELOPMENT SUPPORT [Characterization testing /services] Optical, electronics, mechanics
Photonic Components
PC1 Integrated circuits
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP1 Electronics
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Integration
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
"[Characterization testing /services] Optical, electronics, mechanics"
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
therapeutics
others
Target customers / applications
Technology provider
Supplier
Manufacturer
Production services
Integrator
R&D
Consultancy
Offering Description
The multi-purpose sheartester is used to better characterize bonding shearforce and failure mode. This is suited for die-attach interconnections, wirebonding wires, and solder balls / Stud-bumps.
Offering Reports
Offering specifications
Sheartester Type
DAGE 4000
Tools available
Ball-Shear
Maximum wafer size
8
Custom holder for chips on chips
suited for 300um high chip-on-chip. Other thickness available upon request
Force maximum range across different tools
1g-100Kg
Motorized stage XY and Z
yes
Software for data-log and statistical analysis
yes
Calibration kits for different force ranges
available
Offering Reports description
The multi-purpose sheartester is used to better characterize bonding shearforce and failure mode. This is suited for die-attach interconnections, wirebonding wires, and solder balls / Stud-bumps.
Version
CSEM DS3 0010 V1.0
TRL
MRL
ISO certification
ISO 9001 / MIl-Std 883
Production volume
N/A
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