Complete III-V processing can be achieved in our clean rooms using various technological equipements including:
- Electronic and optical lithography
- Dielectric deposition (PECVD)
- Metallic materials deposition (evaporation or sputtering)
- RIE and ICP etching with fluoride, chloride or CH4/H2 gas
- Wet etching
Characterization equipments are also available, including: SEM, AFM, profilometer, ellipsometer, reflectometer or I(V) measurements.
Wafer size : 2, 3 or 4 inches