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Wafer-level Flex to Rigid
Organization name
Philips
Organization/department description
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
Organisation is
MedPhab partner
Offering type
[TECHNICAL] TECHNICAL SERVICES
Offering block
Non-photonic peripherals
Integration
Technology
INTEGRATION [Component assembly] Module assembly
Photonic Components
PC1 Integrated circuits
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP1 Electronics
NP1 Electronics
Flex-to-Rigid/F2R
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Integration
IN3 Component assembly
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
Rigid board
Flexible foil
Module assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
therapeutics
others
Target customers / applications
Technology provider
Supplier
Manufacturer
Production services
Integrator
R&D
Clinical
Offering Description
Flex-to-rigid (F2R) platform enables the integration of highly miniaturized electronics functionalities in unusual form factors. It consists of two parts. The rigid part, where the wafer level manufacturing technology uses conventional micro fabrication prceses, and the flexible part where the flex interconnect integration on wafer level enables simplified assemby flow by minimizing assembly methods and steps between functional parts. This platform can be used for the fabrication of minimally in
Offering Reports
Offering specifications
Polyimide layer (flex)
2 x 3.5
µm
Metallic layer between the polyimide (flex)
1
µm
Bending radius
50
µm
Length of flex
<2
mm
Al/Cu interconnection layer (flex)
<1
µm
Interconnection layer width (flex)
>6
µm
Interconnection layer pitch (flex)
>10
µm
Si diameter wafer (rigid)
150
mm
Device islands
40 or 80 (not fixed)
µm
Bondpad size (octoginal)
40
µm
Bondpad pitch
Depends on flip chip process
Offering Reports description
Version
1
TRL
1
2
3
4
5
6
7
MRL
1
2
3
4
5
6
7
ISO certification
ISO 9001, ISO 13485, ISO 14001
Production volume
Medium to high volumes
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