Wafer-level Flex to Rigid
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
MedPhab partner
Non-photonic peripherals Integration
INTEGRATION [Component assembly] Module assembly
NP1 Electronics
IN3 Component assembly
Rigid board Flexible foil Module assembly
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Clinical
Flex-to-rigid (F2R) platform enables the integration of highly miniaturized electronics functionalities in unusual form factors. It consists of two parts. The rigid part, where the wafer level manufacturing technology uses conventional micro fabrication prceses, and the flexible part where the flex interconnect integration on wafer level enables simplified assemby flow by minimizing assembly methods and steps between functional parts. This platform can be used for the fabrication of minimally in
Polyimide layer (flex) 2 x 3.5 µm
Metallic layer between the polyimide (flex) 1 µm
Bending radius 50 µm
Length of flex <2 mm
Al/Cu interconnection layer (flex) <1 µm
Interconnection layer width (flex) >6 µm
Interconnection layer pitch (flex) >10 µm
Si diameter wafer (rigid) 150 mm
Device islands 40 or 80 (not fixed) µm
Bondpad size (octoginal) 40 µm
Bondpad pitch Depends on flip chip process
1 2 3 4 5 6 7
1 2 3 4 5 6 7
ISO 9001, ISO 13485, ISO 14001
Medium to high volumes