Chemical Mechanical Planarization (CMP)
Philips
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
MedPhab partner
[TECHNICAL] TECHNICAL SERVICES
Non-photonic peripherals
NON-PHOTONIC PERIFERALS [MEMS] Si-processing
NP4 MEMS
Si-processing SiN-processing
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Clinical
Chemical Mechanical Planarization (CMP) is a process of smoothing surfaces with the combination of chemical and mechanical forces. For more information check our website: https://www.innovationservices.philips.com/looking-expertise/mems-micro-devices/
Different Substrates Si, III/V, glass…
Wafer size 100, 150, 200 mm
1
1 2 3 4 5 6 7 8 9
3 4 5 6 7 8
ISO 9001, ISO 13485, ISO 14001
N/A