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Chemical Mechanical Planarization (CMP)
Organization name
Philips
Organization/department description
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
Organisation is
MedPhab partner
Offering type
[TECHNICAL] TECHNICAL SERVICES
Offering block
Non-photonic peripherals
Technology
NON-PHOTONIC PERIFERALS [MEMS] Si-processing
Photonic Components
PC1 Integrated circuits
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP4 MEMS
NP1 Electronics
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Si-processing
SiN-processing
Integration
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
therapeutics
others
Target customers / applications
Technology provider
Supplier
Manufacturer
Production services
Integrator
R&D
Clinical
Offering Description
Chemical Mechanical Planarization (CMP) is a process of smoothing surfaces with the combination of chemical and mechanical forces. For more information check our website: https://www.innovationservices.philips.com/looking-expertise/mems-micro-devices/
Offering Reports
Offering specifications
Different Substrates
Si, III/V, glass…
Wafer size
100, 150, 200
mm
Offering Reports description
Version
1
TRL
1
2
3
4
5
6
7
8
9
MRL
3
4
5
6
7
8
ISO certification
ISO 9001, ISO 13485, ISO 14001
Production volume
N/A
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