Wire Bonding
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
MedPhab partner
INTEGRATION [Component assembly] Rigid board
IN3 Component assembly
Rigid board Flexible foil Module assembly
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Clinical
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Our wire-bonding capabilities include Au and Al wire bonding as well as die to board/flex/lead frame and die-to-die.
Materials Au, Al
Min-max diameter size 18-50 µm
Min-max pitch 60-n/a µm
3 4 5 6 7 8 9
1 2 3 4 5 6 7 8 9 10
ISO 9001, ISO 13485, ISO 14001
Medium to high volumes