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Thermocompression Bonding
Organization name
Philips
Organization/department description
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
Organisation is
MedPhab partner
Offering type
[TECHNICAL] TECHNICAL SERVICES
Offering block
Integration
Technology
INTEGRATION [Component assembly] Rigid board
Photonic Components
PC1 Integrated circuits
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP1 Electronics
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Integration
IN3 Component assembly
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
Rigid board
Flexible foil
Module assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
therapeutics
others
Target customers / applications
Technology provider
Supplier
Manufacturer
Production services
Integrator
R&D
Clinical
Offering Description
Thermocompression bonding is the process where two metals are brought into atomic contact applying force and heat simultaneously. Our capabilities include Au to Au bonding among others.
Offering Reports
Offering specifications
Materials
Au to Au
Offering Reports description
Version
1
TRL
3
4
5
6
7
8
9
MRL
1
2
3
4
5
6
7
8
9
10
ISO certification
ISO 9001, ISO 13485, ISO 14001
Production volume
Medium to high volumes
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