Pick and Place
Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.
MedPhab partner
INTEGRATION [Component assembly] Rigid board
IN3 Component assembly
Rigid board Flexible foil Module assembly
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Clinical
Pick and place technology is used for placing electronic and optical components, chips or dies onto PCBs or carriers. With our equipment, we can offer a superb placement accuracy while fulfilling other requirements. Also, our equipment supports a wide range of interconnect processes such as ACF, Thermocompression, soldering glue bonding, and heat/UV curing while maintaining a high productivity.
x/y placement accuracy @ 3σ ±0.5 µm
θ placement accuracy @3σ ±0.07 °
θ fine travel ±9°/3.5  µrad
Die attach (size) 0.17-50 mm
Die thickness 0.05-17 mm
Working area max 13x8 inch
Heat curing <450 °C
UV curing >2000 mW/cm2
Bonding 0.05-20 closed-loop N
Bond rotation 0-360 °
Different interconnections See catalog
3 4 5 6 7 8 9
1 2 3 4 5 6 7 8 9 10
ISO 9001, ISO 13485, ISO 14001
Medium to high volumes