Philips Innovation Services creates the bridge from idea to market for each innovation journey. Making innovation work, is our drive as well as our deliverable. By bringing together all the required experience, expertise, methods and tools, we get things done. In a reliable, cost-effective way. On time. Driven by our deep technical creativity, we continue where others stop, to make innovation work.

Pick and place technology is used for placing electronic and optical components, chips or dies onto PCBs or carriers. With our equipment, we can offer a superb placement accuracy while fulfilling other requirements. Also, our equipment supports a wide range of interconnect processes such as ACF, Thermocompression, soldering glue bonding, and heat/UV curing while maintaining a high productivity.