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high-accuracy multi-chip die bonding
VTT-Technical Research Centre of Finland
VTT is one of Europe’s leading research institutions, owned by the Finnish state. Our task is to advance the utilisation and commercialisation of research and technology in commerce and society.
MedPhab partner
[TECHNICAL] TECHNICAL SERVICES
Integration
INTEGRATION [Component assembly] Rigid board
IN3 Component assembly
Rigid board
in vitro diagnostics in vivo diagnostics others
Technology provider Manufacturer Production services Integrator R&D Consultancy Equipment
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
P692-1616504467.pdf
Substrate FR4
Substrate type Sheet
Substrate thickness 0.1-2 mm
Working area 200*300 mm
File format .dxf
Substrate alignment 4 index tags
Component alignment 2 fiducials
Component bonding method ICA
Component type Flex
Component minimum size 0,1 mm
Component maximum size 100 mm
Accuracy +- 10 at 3 Sigma um
Component packaging Wafer
Component mechanical bonding UV-curable NCA
NCA material Acrylic ester
UV wavelength 365 nm
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
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ISO9001
100
Link to Organization registry