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Package Multiphysics Thermal simulation
Organization name
CSEM SA
Organization/department description
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
Organisation is
MedPhab partner
Offering type
[TECHNICAL] DEVELOPMENT SUPPORT
Offering block
Development Support
Technology
DEVELOPMENT SUPPORT [Simulation and analysis] Thermal simulations
Photonic Components
PC1 Integrated circuits
PC2 Microoptics
PC3 Fiberoptics
PC4 Opticalcomponents
PC5 Active components
Non Photonic Peripherals
NP1 Electronics
NP2 Optomechanics
NP3 Microfluidics
NP4 MEMS
Integration
IN1 Fiber/waveguide coupling
IN2 Optical assembly
IN3 Component assembly
IN4 Surface activation
Post-Processing
PP1 Over moulding
PP2 Hermetic sealing
PP3 Opto fluidic interface
PP4 Thin film deposition
Development support
[Simulation and analysis] Thermal simulations
Non technical services
Field of application
in vitro diagnostics
in vivo diagnostics
therapeutics
others
Target customers / applications
Technology provider
Supplier
Manufacturer
Production services
Integrator
R&D
Clinical
Consultancy
Equipment
Offering Description
Package Thermal FEM simulation including Peltier (TEC) and fluid Physics
Offering Reports
128364-name-CSEM-STR-2019-p30-1616504479.pdf
Offering specifications
Modeling software
Comsol Multiphysics
File format input
Solidworks/Parasolid or 2D sketch
File format output
.mph
Housing concept
Housing concept description + 2D/3D sketch model (solidworks)
Material data
Material database available in Comsol (might require external data)
calibrated TEC modeling
Possible with TEC measurement data/supplier data
Simulation of operating conditions
Different ambient air temperatures/ chip power
Multi-physics modeling
Thermal
Optimization of the housing
Possible if performance/goal specifications are set (Tj max
Post-processing options
Graphs showing thermal/fluidic/electric or combined aspects
GUI interface for ease of use / dissemination
APP feature in Comsol (free to distribute) with automated reporting
Offering Reports description
Thermal Management Modeling of components in a housing. It includes TEC calibrated model. The model is a thermal-fludic-electric coupled multi-physics FEM simulation performed in COMSOL.
Version
CSEM DS1 0001 V1.0
TRL
MRL
ISO certification
ISO 9001
Production volume
N/A
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