Package Multiphysics Thermal simulation
CSEM is a privately held, R&D center established in 1984 in Neuchâtel, Switzerland. From the beginning, CSEM has been committed to both applied and order-related R&D. This bridge function between economics and science is still a core aspect of the company, and CSEM has continuously adapted its research areas to the needs of industry.
MedPhab partner
Development Support
DEVELOPMENT SUPPORT [Simulation and analysis] Thermal simulations
[Simulation and analysis] Thermal simulations
in vitro diagnostics in vivo diagnostics therapeutics others
Technology provider Supplier Manufacturer Production services Integrator R&D Clinical Consultancy Equipment
Package Thermal FEM simulation including Peltier (TEC) and fluid Physics
Modeling software Comsol Multiphysics
File format input Solidworks/Parasolid or 2D sketch
File format output .mph
Housing concept Housing concept description + 2D/3D sketch model (solidworks)
Material data Material database available in Comsol (might require external data)
calibrated TEC modeling Possible with TEC measurement data/supplier data
Simulation of operating conditions Different ambient air temperatures/ chip power
Multi-physics modeling Thermal
Optimization of the housing Possible if performance/goal specifications are set (Tj max
Post-processing options Graphs showing thermal/fluidic/electric or combined aspects
GUI interface for ease of use / dissemination APP feature in Comsol (free to distribute) with automated reporting
Thermal Management Modeling of components in a housing. It includes TEC calibrated model. The model is a thermal-fludic-electric coupled multi-physics FEM simulation performed in COMSOL.
CSEM DS1 0001 V1.0
ISO 9001